Cluster Structure Diamond Powders

Cluster Diamond Powder Based Solutions

Product Line Code DP1-SCP

UK Abrasives, Inc. is one of three manufacturers of polycrystalline structure diamond powder in the world. The powder manufacturing plant has its own grading facilities utilizing state-of-the-art, highly customized processing equipment.

As the result of ongoing R&D efforts, UK Abrasives, Inc. has developed a precisely graded line of Cluster Structure Diamond Powders that is a primary choice for HDD texturing applications. Transition to PMR recording in the HDD industry prompted UKA to develop a diamond product line specifically for SCP (Surface Conditioning Process) applications .

DP1-SCP grade powder has an average crystallite size of 3-4 nm and tightly controlled grading was developed to control scratching; which is one of the most critical characteristics of overall powder performance. Special steps in the manufacturing process assure the removal of very minute quantities of coarser particles that cause scratching of conditioned surfaces.

UKA offers cluster diamond powders DP1-SCP suspended in de-ionized water as stand-alone products and DP1-SCP-S (Ready-to-Use) slurries which are optimized for SCP application. Clean room production environment in all production facilities assures contaminant-free products. Both products have a standard shelf life of one year

Among standard powder sizes are D50=4 nm, D50=60 nm and D50=120 nm. Custom grading is also available

UK Abrasives has a large inventory of cluster type diamond powder; on-premises custom grading capabilities going hand-in-hand with strict quality control, ISO 9002 governed manufacturing and customer service practices. Quick turn-around time for customizing products makes working with UK Abrasives a very pleasant experience

Our production facility is ISO 9001-2008 registered and located in Northbrook, Illinois (a North Chicago suburb), and just 20 minutes from Chicago O’Hare International Airport, facilitating local and international deliveries.

We look forward to working with you on your next project.

Bulletin UKA\DM1-G Rev. 0 12.23.2002

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